through mold interconnection assessment for advanced fan out wafer level packaging applications
| Description | |
| Date | 2020 |
| Date | |
| Auteurs | Plihon,- A | Deschaseaux,- E | Franiatte,- R | Argoux,- M | Dechamp,- J | Guillaume,- J | Charbonnier,- J | |
| Source | 2018 IEEE Global Conference on Signal and Information Processing,- GlobalSIP 2018 | 33rd Conference on Design of Circuits and Integrated Systems,- DCIS 2018 | |
| Résumé | This study demonstrates the process feasibility and electrical performances of Through Mold Interconnections (TMI) integrated in a Fan Out Wafer Level Packaging (FOLWP) configuration. With an interesting aspect-ratio,- a low pitch and a small diameter,- the TMIs are assessed thanks to the connection to two Redistributions Layers (RDL) on each side of a chip embedded in an Epoxy Molding Compound (EMC). Single interconnection and several daisy chains have been electrically characterized and show low interconnection resistance. © 2020 IEEE. |
| DOI | http://dx.doi.org/10.1109/ESTC48849.2020.9229773 |
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